LOCTITE® ECCOBOND UF 3810
功能與優點
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
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技術資訊
| 使用期限 | 3.0 日 |
| 建議固化方式, @ 130.0 °C | 8.0 分 |
| 熱膨脹係數 (CTE), Above Tg | 171.0 ppm/°C |
| 熱膨脹係數 (CTE), Below Tg | 55.0 ppm/°C |
| 玻璃化溫度(Tg) | 102.0 °C |
| 粘度，錐型和板型, @ 25.0 °C Shear Rate 20 s⁻¹ | 394.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3810
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill