LOCTITE® ECCOBOND UF 3810
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LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
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Tehnične informacije
| Delovni čas uporabe zmesi | 3.0 dnevi |
| Koeficient toplotnega raztezanja (CTE), Above Tg | 171.0 ppm/°C |
| Koeficient toplotnega raztezanja (CTE), Below Tg | 55.0 ppm/°C |
| Temperatura posteklenitve (Tg) | 102.0 °C |
| Urnik strjevanja, @ 130.0 °C | 8.0 min. |
| Viskoznost, stožec in plošča, @ 25.0 °C Shear Rate 20 s⁻¹ | 394.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3810
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill