LOCTITE® ECCOBOND UF 3810
Features and Benefits
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 171.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 55.0 ppm/°C |
| Cure schedule, @ 130.0 °C | 8.0 min. |
| Glass transition temperature (Tg) | 102.0 °C |
| Viscosity, cone & plate, @ 25.0 °C Shear Rate 20 s⁻¹ | 394.0 mPa·s (cP) |
| Work life | 3.0 day |
LOCTITE® ECCOBOND UF 3810
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill