LOCTITE® ECCOBOND UF 3810
Omadused ja eelised
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
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Tehniline teave
| Kasseti viskoossus, koonus ja plaat, @ 25.0 °C Shear Rate 20 s⁻¹ | 394.0 mPa.s (cP) |
| Klaasistumistemperatuur (Tg) | 102.0 °C |
| Kõvenemisaeg, @ 130.0 °C | 8.0 minut |
| Soojuspaisumise koefitsient (CTE), Above Tg | 171.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Below Tg | 55.0 ppm/°C |
| Tööiga | 3.0 päev |
LOCTITE® ECCOBOND UF 3810
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill