LOCTITE® ECCOBOND FP4460
Lastnosti in prednosti
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.
LOCTITE® ECCOBOND FP4460 encapsulant is specially designed for the protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. You can expect high flow, high temperature performance, excellent chemical resistance, and excellent moisture resistance.
Preberite več
Dokumenti in prenosi
Ali iščete tehnični list ali varnostni list v drugem jeziku?
Tehnične informacije
| Barva | Črna |
| Delovna temperatura | -65.0 - 150.0 °C |
| Koeficient toplotnega raztezanja (CTE), Below Tg | 20.0 ppm/°C |
| Način strjevanja | Strjevanje na podlagi toplote |
| Specifična težnost, @ 25.0 °C | 1.78 |
| Temperatura posteklenitve (Tg) | 173.0 °C |
| Urnik strjevanja, @ 150.0 °C | 3.0 ure |
| Viskoznost, Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm | 300000.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4460
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.