LOCTITE® ECCOBOND FP4460
Características e Benefícios
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.
LOCTITE® ECCOBOND FP4460 encapsulant is specially designed for the protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. You can expect high flow, high temperature performance, excellent chemical resistance, and excellent moisture resistance.
Ler mais
Documentos e Downloads
Procurando por um TDS ou MSDS / FISPQ em outro idioma?
Informação Técnica
| Coeficiente de expansão térmica (CTE), Below Tg | 20.0 ppm/°C |
| Cor | Preto |
| Cronograma de cura, @ 150.0 °C | 3.0 hr. |
| Gravidade específica, @ 25.0 °C | 1.78 |
| Temperatura de operação | -65.0 - 150.0 °C |
| Temperatura de transição do vidro (Tg) | 173.0 °C |
| Tipo de cura | Cura por Calor |
| Viscosidade, Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm | 300000.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4460
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.