LOCTITE® ECCOBOND FP4460
Features and Benefits
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.
LOCTITE® ECCOBOND FP4460 encapsulant is specially designed for the protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. You can expect high flow, high temperature performance, excellent chemical resistance, and excellent moisture resistance.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Coefficient of thermal expansion (CTE), Below Tg | 20.0 ppm/°C |
| Colour | Black |
| Cure schedule, @ 150.0 °C | 3.0 hr. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 173.0 °C |
| Operating temperature | -65.0 - 150.0 °C |
| Specific gravity, @ 25.0 °C | 1.78 |
| Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm | 300000.0 mPa·s (cP) |
LOCTITE® ECCOBOND FP4460
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.