LOCTITE® ECCOBOND FP4460
功能與優點
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.
LOCTITE® ECCOBOND FP4460 encapsulant is specially designed for the protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. You can expect high flow, high temperature performance, excellent chemical resistance, and excellent moisture resistance.
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技術資訊
| 固化類型 | 熱固化 |
| 建議固化方式, @ 150.0 °C | 3.0 小時 |
| 操作溫度 | -65.0 - 150.0 °C |
| 比重, @ 25.0 °C | 1.78 |
| 熱膨脹係數 (CTE), Below Tg | 20.0 ppm/°C |
| 玻璃化溫度(Tg) | 173.0 °C |
| 粘度，Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm | 300000.0 mPa.s (cP) |
| 顏色 | 黑色 |
LOCTITE® ECCOBOND FP4460
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.