LOCTITE® ECCOBOND FP4460
Características y Ventajas
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.
LOCTITE® ECCOBOND FP4460 encapsulant is specially designed for the protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. You can expect high flow, high temperature performance, excellent chemical resistance, and excellent moisture resistance.
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Información técnica
| Coeficiente de dilatación térmica (CDT), Below Tg | 20.0 ppm/°C |
| Color | Negro |
| Gravedad específica, @ 25.0 °C | 1.78 |
| Programa de curado, @ 150.0 °C | 3.0 h |
| Temperatura de funcionamiento | -65.0 - 150.0 °C |
| Temperatura de transición vítrea (Tg) | 173.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm | 300000.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4460
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.