LOCTITE® ECCOBOND FP4460
Merkmale und Vorteile
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.
LOCTITE® ECCOBOND FP4460 encapsulant is specially designed for the protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. You can expect high flow, high temperature performance, excellent chemical resistance, and excellent moisture resistance.
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Technische Informationen
| Aushärtetechnik | Aushärtung durch Wärme |
| Aushärtezyklus, @ 150.0 °C | 3.0 h |
| Betriebstemperatur | -65.0 - 150.0 °C |
| Farbe | Schwarz |
| Glasübergangstemperatur (Tg) | 173.0 °C |
| Spezifisches Gewicht, @ 25.0 °C | 1.78 |
| Viskosität, Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm | 300000.0 mPa.s (cP) |
| Wärmeausdehnungskoeffizient (CTE), Below Tg | 20.0 ppm/°C |
LOCTITE® ECCOBOND FP4460
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.