LOCTITE® ECCOBOND FP4460

Features and Benefits

This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.
LOCTITE® ECCOBOND FP4460 encapsulant is specially designed for the protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. You can expect high flow, high temperature performance, excellent chemical resistance, and excellent moisture resistance.
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Technical Information

Coefficient of thermal expansion (CTE), Below Tg 20.0 ppm/°C
Color Black
Cure schedule, @ 150.0 °C 3.0 hr.
Cure type Heat cure
Glass transition temperature (Tg) 173.0 °C
Operating temperature -65.0 - 150.0 °C
Specific gravity, @ 25.0 °C 1.78
Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm 300000.0 mPa·s (cP)