LOCTITE® ECCOBOND FP4460
Vlastnosti a výhody
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.
LOCTITE® ECCOBOND FP4460 encapsulant is specially designed for the protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. You can expect high flow, high temperature performance, excellent chemical resistance, and excellent moisture resistance.
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Technické informace
| Barva | Černá |
| Koeficient tepelné roztažnosti (CTE), Below Tg | 20.0 ppm/°C |
| Plán vytvrzení, @ 150.0 °C | 3.0 hod. |
| Provozní teplota | -65.0 - 150.0 °C |
| Specifická gravitace, @ 25.0 °C | 1.78 |
| Teplota skelného přechodu (Tg) | 173.0 °C |
| Viskozita, Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm | 300000.0 mPa.s (cP) |
| Způsob vytvrzování | Vytvrzování teplem |
LOCTITE® ECCOBOND FP4460
This low stress, high purity, high-temperature-performance epoxy encapsulant is designed for protecting bare semiconductor devices.