LOCTITE® ABLESTIK 2033SC
Tuntud kui ABLEBOND 2033SC (13G)
Omadused ja eelised
A 1-part, red, non-conductive die-attach adhesive for high throughput smart card bonding applications.
LOCTITE ABLESTIK 2033SC is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for high-throughput smart card bonding applications. It’s compatible with various encapsulant chemistries. It has a long work life, exhibits minimal resin bleed-out (RBO), and cures fast when exposed to heat.
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Tehniline teave
| Ekstraheeritav ioonisisu, Kaalium (K+) | 4.0 ppm |
| Ekstraheeritav ioonisisu, Kloriid (CI-) | 29.0 ppm |
| Ekstraheeritav ioonisisu, Naatrium (Na+) | 14.0 ppm |
| Klaasistumistemperatuur (Tg) | 46.0 °C |
| Kõvenemisaeg, 2. alternatiiv @ 150.0 °C | 10.0 sekund |
| Kõvenemisaeg, Alternatiiv @ 120.0 °C | 60.0 sekund |
| Kõvenemisaeg, Soovitatav @ 110.0 °C | 90.0 sekund |
| Peamised omadused | Surve: Madal, Tahkumiskiirus: Kiire |
| Rakendused | Stantskinnitus |
| Soojuspaisumise koefitsient (CTE) | 56.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Above Tg | 133.0 ppm/°C |
| Tahkumistüüp | Kuumkõvenemine |
| Tiksotroopne indeks | 6.1 |
| Tõmbemoodul, DMTA @ 200.0 °C | 60.0 N/mm² (8600.0 psi ) |
| Viskoossus, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11300.0 mPa.s (cP) |
LOCTITE® ABLESTIK 2033SC
A 1-part, red, non-conductive die-attach adhesive for high throughput smart card bonding applications.