LOCTITE® ABLESTIK 2033SC

Known as ABLEBOND 2033SC (13G)

Features and Benefits

A 1-part, red, non-conductive die-attach adhesive for high throughput smart card bonding applications.
LOCTITE ABLESTIK 2033SC is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for high-throughput smart card bonding applications. It’s compatible with various encapsulant chemistries. It has a long work life, exhibits minimal resin bleed-out (RBO), and cures fast when exposed to heat.
  • Fast curing
  • Non-conductive
  • Excellent resin bleed-out performance
  • Long work life
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 56.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 133.0 ppm/°C
Cure schedule, Alternate 2 @ 150.0 °C 10.0 sec.
Cure schedule, Alternate @ 120.0 °C 60.0 sec.
Cure schedule, Recommended @ 110.0 °C 90.0 sec.
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 29.0 ppm
Extractable ionic content, Potassium (K+) 4.0 ppm
Extractable ionic content, Sodium (Na+) 14.0 ppm
Glass transition temperature (Tg) 46.0 °C
Key characteristics Cure speed: fast cure, Stress: low stress
Tensile modulus, DMTA @ 200.0 °C 60.0 N/mm² (8600.0 psi )
Thixotropic index 6.1
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 11300.0 mPa·s (cP)