LOCTITE® ECCOBOND FP4450
Lastnosti in prednosti
Choose this epoxy encapsulant for pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type.
LOCTITE® ECCOBOND FP4450 encapsulant is designed for protecting bare semiconductor devices. It is low stress, high purity, and offers good moisture resistance. You can also rely on pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control.
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Tehnične informacije
| Barva | Črna |
| Delovna temperatura | -65.0 - 150.0 °C |
| Koeficient toplotnega raztezanja (CTE), Below Tg | 22.0 ppm/°C |
| Način strjevanja | Strjevanje na podlagi toplote |
| Polnila | 73.0 % |
| Specifična težnost, @ 25.0 °C | 1.77 |
| Temperatura posteklenitve (Tg) | 155.0 °C |
| Temperatura skladiščenja | -40.0 °C |
| Urnik strjevanja, Nadomestni @ 165.0 °C | 90.0 min. |
| Urnik strjevanja, Priporočeno @ 125.0 °C | 30.0 min. |
| Viskoznost, Brookfield - RVT, @ 25.0 °C Spindle 7, speed 20 rpm | 43900.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4450
Choose this epoxy encapsulant for pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type.