LOCTITE® ECCOBOND FP4450
功能與優點
Choose this epoxy encapsulant for pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type.
LOCTITE® ECCOBOND FP4450 encapsulant is designed for protecting bare semiconductor devices. It is low stress, high purity, and offers good moisture resistance. You can also rely on pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control.
瞭解更多
文件和下載
您的位置和語言沒有可用的檔和下載內容。您可以嘗試使用另一種語言搜索檔
技術資訊
| 儲存溫度 | -40.0 °C |
| 固化類型 | 熱固化 |
| 填料 | 73.0 % |
| 建議固化方式, 可供選擇的 @ 165.0 °C | 90.0 分 |
| 建議固化方式, 推薦的： @ 125.0 °C | 30.0 分 |
| 操作溫度 | -65.0 - 150.0 °C |
| 比重, @ 25.0 °C | 1.77 |
| 熱膨脹係數 (CTE), Below Tg | 22.0 ppm/°C |
| 玻璃化溫度(Tg) | 155.0 °C |
| 粘度，Brookfield - RVT, @ 25.0 °C Spindle 7, speed 20 rpm | 43900.0 mPa.s (cP) |
| 顏色 | 黑色 |
LOCTITE® ECCOBOND FP4450
Choose this epoxy encapsulant for pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type.