LOCTITE® ECCOBOND FP4450
Features and Benefits
Choose this epoxy encapsulant for pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type.
LOCTITE® ECCOBOND FP4450 encapsulant is designed for protecting bare semiconductor devices. It is low stress, high purity, and offers good moisture resistance. You can also rely on pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control.
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Technical Information
| Coefficient of thermal expansion (CTE), Below Tg | 22.0 ppm/°C |
| Color | Black |
| Cure schedule, Alternate @ 165.0 °C | 90.0 min. |
| Cure schedule, Recommended @ 125.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Filler | 73.0 % |
| Glass transition temperature (Tg) | 155.0 °C |
| Operating temperature | -65.0 - 150.0 °C |
| Specific gravity, @ 25.0 °C | 1.77 |
| Storage temperature | -40.0 °C |
| Viscosity, Brookfield - RVT, @ 25.0 °C Spindle 7, speed 20 rpm | 43900.0 mPa·s (cP) |
LOCTITE® ECCOBOND FP4450
Choose this epoxy encapsulant for pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type.