LOCTITE® ECCOBOND FP4450
Características y Ventajas
Choose this epoxy encapsulant for pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type.
LOCTITE® ECCOBOND FP4450 encapsulant is designed for protecting bare semiconductor devices. It is low stress, high purity, and offers good moisture resistance. You can also rely on pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control.
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Información técnica
| Coeficiente de dilatación térmica (CDT), Below Tg | 22.0 ppm/°C |
| Color | Negro |
| Gravedad específica, @ 25.0 °C | 1.77 |
| Programa de curado, Alternativo @ 165.0 °C | 90.0 min |
| Programa de curado, Recomendado @ 125.0 °C | 30.0 min |
| Relleno | 73.0 % |
| Temperatura de almacenaje | -40.0 °C |
| Temperatura de funcionamiento | -65.0 - 150.0 °C |
| Temperatura de transición vítrea (Tg) | 155.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, Brookfield - RVT, @ 25.0 °C Spindle 7, speed 20 rpm | 43900.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4450
Choose this epoxy encapsulant for pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type.