LOCTITE® ECCOBOND FP4450

Features and Benefits

Choose this epoxy encapsulant for pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type.  
LOCTITE® ECCOBOND FP4450 encapsulant is designed for protecting bare semiconductor devices. It is low stress, high purity, and offers good moisture resistance. You can also rely on pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control. 
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Technical Information

Coefficient of thermal expansion (CTE), Below Tg 22.0 ppm/°C
Colour Black
Cure schedule, Alternate @ 165.0 °C 90.0 min.
Cure schedule, Recommended @ 125.0 °C 30.0 min.
Cure type Heat cure
Filler 73.0 %
Glass transition temperature (Tg) 155.0 °C
Operating temperature -65.0 - 150.0 °C
Specific gravity, @ 25.0 °C 1.77
Storage temperature -40.0 °C
Viscosity, Brookfield - RVT, @ 25.0 °C Spindle 7, speed 20 rpm 43900.0 mPa·s (cP)