LOCTITE® ECCOBOND FP4450
Elementi i pogodnosti
Choose this epoxy encapsulant for pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type.
LOCTITE® ECCOBOND FP4450 encapsulant is designed for protecting bare semiconductor devices. It is low stress, high purity, and offers good moisture resistance. You can also rely on pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control.
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Tehnički podaci
| Boja | Crna |
| Koeficijent toplotnog širenja (CTE), Below Tg | 22.0 ppm/°C |
| Punioca | 73.0 % |
| Radna temperatura | -65.0 - 150.0 °C |
| Raspored polimerizacije, Alternativa @ 165.0 °C | 90.0 minuta |
| Raspored polimerizacije, Preporučeno @ 125.0 °C | 30.0 minuta |
| Specifična težina, @ 25.0 °C | 1.77 |
| Temperatura razmekšavanja (Tg) | 155.0 °C |
| Temperatura čuvanja | -40.0 °C |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
| Viskoznost, Brookfield - RVT, @ 25.0 °C Spindle 7, speed 20 rpm | 43900.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4450
Choose this epoxy encapsulant for pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type.