LOCTITE® ABLESTIK 2300
Known as ABLEBOND 2300
Features and Benefits
LOCTITE ABLESTIK 2300, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK 2300 electrically conductive adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. This adhesive is also designed for ease of manufacturing.
- High hot/wet adhesion
- Ultra-low moisture absorption
- Low stress
- Fast cure with no voids
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 60.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Hot die shear strength | 9.2 kg-f |
| RT die shear strength | 13.2 kg-f |
| Tensile modulus, @ 250.0 °C | 234.0 N/mm² (34000.0 psi ) |
LOCTITE® ABLESTIK 2300
LOCTITE ABLESTIK 2300, Proprietary Hybrid Chemistry, Die Attach