LOCTITE® ABLESTIK 2300
旧名称 ABLEBOND 2300
特長および利点
LOCTITE ABLESTIK 2300, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK 2300 electrically conductive adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. This adhesive is also designed for ease of manufacturing.
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技術情報
| RTダイせん断強度 | 13.2 kg-f |
| アプリケーション(用途) | ダイ接着剤 |
| ホットダイせん断強さ | 9.2 kg-f |
| 引張係数, @ 250.0 °C | 234.0 N/mm² (34000.0 psi ) |
| 抽出可能なイオン含有量, カリウム(K+) | 9.0 ppm |
| 抽出可能なイオン含有量, ナトリウム(Na+) | 9.0 ppm |
| 抽出可能なイオン含有量, 塩化物 (CI-) | 9.0 ppm |
| 熱膨張率 | 60.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
LOCTITE® ABLESTIK 2300
LOCTITE ABLESTIK 2300, Proprietary Hybrid Chemistry, Die Attach