LOCTITE® ABLESTIK 2100A
被称为 ABLEBOND 2100A (34G)
功能与优点
This fast-cure die-attach adhesive is designed for Pb-free PBGA and array BGA packaging.
LOCTITE® ABLESTIK 2100A is a silver die-attach adhesive for Pb-free PBGA and array BGA packaging, made to withstand 500°F (260°C) reflow. It’s designed with a proprietary hybrid chemistry technology, offers excellent dispensing characteristics and cures fast when exposed to heat. It exhibits high hot/wet adhesion, low stress and bleed and ultra-low moisture absorption.
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技术信息
| RT 模剪切强度 | 16.0 kg-f |
| 可萃取出的离子含量, 氯化物 (CI-) | 9.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 9.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 9.0 ppm |
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 拉伸模量, DMTA @ 250.0 °C | 234.0 N/mm² (34000.0 psi ) |
| 拉伸模量, DMTA @ 65.0 °C | 3172.0 N/mm² (460000.0 psi ) |
| 热模剪切强度 | 5.0 kg-f |
| 热膨胀系数 (CTE) | 65.0 ppm/°C |
LOCTITE® ABLESTIK 2100A
This fast-cure die-attach adhesive is designed for Pb-free PBGA and array BGA packaging.