LOCTITE® ABLESTIK 2100A

Known as ABLEBOND 2100A (34G)

Features and Benefits

This die attach adhesive is specially designed for Pb-free array packaging and is suitable for die sizes up to 12.7mm x 12.7mm (0.5in x 0.5in). 
LOCTITE® ABLESTIK 2100A die attach adhesive is specifically designed for Pb-free array packaging. It is able to withstand the high reflow temperatures necessary for Pb-free solders at 260°C (500°F). It is suitable for die sizes up to 12.7 x 12.7mm (0.5in x 0.5in), has high hot/wet adhesion, ultra-low moisture absorption, and excellent dispensing characteristics.
  • High hot/wet adhesion
  • Ultra-low moisture absorption
  • Low bleed and low stress
  • Fast cure capability
  • Pb-free applications
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 65.0 ppm/°C
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 9.0 ppm
Extractable ionic content, Potassium (K+) 9.0 ppm
Extractable ionic content, Sodium (Na+) 9.0 ppm
Hot die shear strength 5.0 kg-f
RT die shear strength 16.0 kg-f
Tensile modulus, DMTA @ 250.0 °C 234.0 N/mm² (34000.0 psi )
Tensile modulus, DMTA @ 65.0 °C 3172.0 N/mm² (460000.0 psi )