LOCTITE® ABLESTIK 2100A
Known as ABLEBOND 2100A (34G)
Features and Benefits
This fast-cure die-attach adhesive is designed for Pb-free PBGA and array BGA packaging.
LOCTITE® ABLESTIK 2100A is a silver die-attach adhesive for Pb-free PBGA and array BGA packaging, made to withstand 500°F (260°C) reflow. It’s designed with a proprietary hybrid chemistry technology, offers excellent dispensing characteristics and cures fast when exposed to heat. It exhibits high hot/wet adhesion, low stress and bleed and ultra-low moisture absorption.
- Suitable for die sizes up to 12.7x12.7mm
- Ultra-low moisture absorption
- Designed for Pb-free applications
- Low stress and low bleed
- Fast curing
Documents and Downloads
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Additional Documents
Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 65.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Hot die shear strength | 5.0 kg-f |
| RT die shear strength | 16.0 kg-f |
| Tensile modulus, DMTA @ 250.0 °C | 234.0 N/mm² (34000.0 psi ) |
| Tensile modulus, DMTA @ 65.0 °C | 3172.0 N/mm² (460000.0 psi ) |
LOCTITE® ABLESTIK 2100A
This fast-cure die-attach adhesive is designed for Pb-free PBGA and array BGA packaging.