LOCTITE® ABLESTIK 2100A
被稱為 ABLEBOND 2100A (34G)
功能與優點
This fast-cure die-attach adhesive is designed for Pb-free PBGA and array BGA packaging.
LOCTITE® ABLESTIK 2100A is a silver die-attach adhesive for Pb-free PBGA and array BGA packaging, made to withstand 500°F (260°C) reflow. It’s designed with a proprietary hybrid chemistry technology, offers excellent dispensing characteristics and cures fast when exposed to heat. It exhibits high hot/wet adhesion, low stress and bleed and ultra-low moisture absorption.
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技術資訊
| RT 模剪切強度 | 16.0 kg-f |
| 可萃取出的離子含量, 氯化物(CI-) | 9.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 9.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 9.0 ppm |
| 固化類型 | 熱固化 |
| 應用 | 晶片焊接 |
| 拉伸模量, DMTA @ 250.0 °C | 234.0 N/mm² (34000.0 psi ) |
| 拉伸模量, DMTA @ 65.0 °C | 3172.0 N/mm² (460000.0 psi ) |
| 熱模剪切強度 | 5.0 kg-f |
| 熱膨脹係數 (CTE) | 65.0 ppm/°C |
LOCTITE® ABLESTIK 2100A
This fast-cure die-attach adhesive is designed for Pb-free PBGA and array BGA packaging.