LOCTITE® ABLESTIK 2100A
Zināms kā ABLEBOND 2100A (34G)
Iezīmes un ieguvumi
This die attach adhesive is specially designed for Pb-free array packaging and is suitable for die sizes up to 12.7mm x 12.7mm (0.5in x 0.5in).
LOCTITE® ABLESTIK 2100A die attach adhesive is specifically designed for Pb-free array packaging. It is able to withstand the high reflow temperatures necessary for Pb-free solders at 260°C (500°F). It is suitable for die sizes up to 12.7 x 12.7mm (0.5in x 0.5in), has high hot/wet adhesion, ultra-low moisture absorption, and excellent dispensing characteristics.
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Tehniskā informācija
| Iegūstamais jonu saturs, Hlorīds (CI-) | 9.0 ppm |
| Iegūstamais jonu saturs, Kālijs (K +) | 9.0 ppm |
| Iegūstamais jonu saturs, Nātrijs (Na +) | 9.0 ppm |
| Karstā spiedogabīdes izturība | 5.0 kg-f |
| Pielietojumi | Spiedoga pievienošana |
| RT spiedoga bīdes izturība | 16.0 kg-f |
| Sacietināšanas veids | Sacietināšana karsējot |
| Stiepes modulis, DMTA @ 250.0 °C | 234.0 N/mm² (34000.0 psi ) |
| Stiepes modulis, DMTA @ 65.0 °C | 3172.0 N/mm² (460000.0 psi ) |
| Termiskās izplešanās koeficients (CTE) | 65.0 ppm/°C |
LOCTITE® ABLESTIK 2100A
This die attach adhesive is specially designed for Pb-free array packaging and is suitable for die sizes up to 12.7mm x 12.7mm (0.5in x 0.5in).