LOCTITE® ABLESTIK 2100A
Zināms kā ABLEBOND 2100A (34G)
Iezīmes un ieguvumi
This fast-cure die-attach adhesive is designed for Pb-free PBGA and array BGA packaging.
LOCTITE® ABLESTIK 2100A is a silver die-attach adhesive for Pb-free PBGA and array BGA packaging, made to withstand 500°F (260°C) reflow. It’s designed with a proprietary hybrid chemistry technology, offers excellent dispensing characteristics and cures fast when exposed to heat. It exhibits high hot/wet adhesion, low stress and bleed and ultra-low moisture absorption.
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Tehniskā informācija
| Iegūstamais jonu saturs, Hlorīds (CI-) | 9.0 ppm |
| Iegūstamais jonu saturs, Kālijs (K +) | 9.0 ppm |
| Iegūstamais jonu saturs, Nātrijs (Na +) | 9.0 ppm |
| Karstā spiedogabīdes izturība | 5.0 kg-f |
| Pielietojumi | Spiedoga pievienošana |
| RT spiedoga bīdes izturība | 16.0 kg-f |
| Sacietināšanas veids | Sacietināšana karsējot |
| Stiepes modulis, DMTA @ 250.0 °C | 234.0 N/mm² (34000.0 psi ) |
| Stiepes modulis, DMTA @ 65.0 °C | 3172.0 N/mm² (460000.0 psi ) |
| Termiskās izplešanās koeficients (CTE) | 65.0 ppm/°C |
LOCTITE® ABLESTIK 2100A
This fast-cure die-attach adhesive is designed for Pb-free PBGA and array BGA packaging.