LOCTITE® ABLESTIK 2100A
旧名称 ABLEBOND 2100A (34G)
特長および利点
This fast-cure die-attach adhesive is designed for Pb-free PBGA and array BGA packaging.
LOCTITE® ABLESTIK 2100A is a silver die-attach adhesive for Pb-free PBGA and array BGA packaging, made to withstand 500°F (260°C) reflow. It’s designed with a proprietary hybrid chemistry technology, offers excellent dispensing characteristics and cures fast when exposed to heat. It exhibits high hot/wet adhesion, low stress and bleed and ultra-low moisture absorption.
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技術情報
| RTダイせん断強度 | 16.0 kg-f |
| アプリケーション(用途) | ダイ接着剤 |
| ホットダイせん断強さ | 5.0 kg-f |
| 引張係数, DMTA @ 250.0 °C | 234.0 N/mm² (34000.0 psi ) |
| 引張係数, DMTA @ 65.0 °C | 3172.0 N/mm² (460000.0 psi ) |
| 抽出可能なイオン含有量, カリウム(K+) | 9.0 ppm |
| 抽出可能なイオン含有量, ナトリウム(Na+) | 9.0 ppm |
| 抽出可能なイオン含有量, 塩化物 (CI-) | 9.0 ppm |
| 熱膨張率 | 65.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
LOCTITE® ABLESTIK 2100A
This fast-cure die-attach adhesive is designed for Pb-free PBGA and array BGA packaging.