LOCTITE® ECCOBOND UF 8830S
Lastnosti in prednosti
This liquid epoxy underfill encapsulant is specially formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.
LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is specially designed to improve crack/fracture resistance and deliver faster flow. When fully cured, it forms a rigid, low-stress seal that dissipates stress in solder joints and extends thermal cycling performance.
Preberite več
Dokumenti in prenosi
Ali iščete tehnični list ali varnostni list v drugem jeziku?
Tehnične informacije
| Koeficient toplotnega raztezanja (CTE), Above Tg | 100.0 ppm/°C |
| Koeficient toplotnega raztezanja (CTE), Below Tg | 25.0 ppm/°C |
| Modul za shranjevanje, DMA @ 25.0 °C | 11500.0 N/mm² (1667934.0 psi ) |
| Temperatura posteklenitve (Tg) | 118.0 °C |
| Temperatura skladiščenja | -40.0 °C |
| Viskoznost, Brookfield, @ 25.0 °C Spindle 51, Speed 5 rpm | 22120.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 8830S
This liquid epoxy underfill encapsulant is specially formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.