LOCTITE® ECCOBOND UF 8830S
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This liquid epoxy underfill encapsulant is specially formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.
LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is specially designed to improve crack/fracture resistance and deliver faster flow. When fully cured, it forms a rigid, low-stress seal that dissipates stress in solder joints and extends thermal cycling performance.
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Información técnica
| Coeficiente de dilatación térmica (CDT), Above Tg | 100.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Below Tg | 25.0 ppm/°C |
| Módulo de almacenaje, DMA @ 25.0 °C | 11500.0 N/mm² (1667934.0 psi ) |
| Temperatura de almacenaje | -40.0 °C |
| Temperatura de transición vítrea (Tg) | 118.0 °C |
| Viscosidad, Brookfield, @ 25.0 °C Spindle 51, Speed 5 rpm | 22120.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 8830S
This liquid epoxy underfill encapsulant is specially formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.