LOCTITE® ECCOBOND UF 8830S
Χαρακτηριστικά και οφέλη
This liquid epoxy underfill encapsulant is specially formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.
LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is specially designed to improve crack/fracture resistance and deliver faster flow. When fully cured, it forms a rigid, low-stress seal that dissipates stress in solder joints and extends thermal cycling performance.
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Έγγραφα και λήψεις
Ψάχνετε για TDS ή SDS σε άλλη γλώσσα;
Τεχνικές πληροφορίες
| Lämpölaajenemiskerroin (CTE), Above Tg | 100.0 ppm/°C |
| Lämpölaajenemiskerroin (CTE), Below Tg | 25.0 ppm/°C |
| Θερμοκρασία αποθήκευσης | -40.0 °C |
| Ιξώδες, Brookfield, @ 25.0 °C Spindle 51, Speed 5 rpm | 22120.0 mPa.s (cP) |
| Μέτρο αποθήκευσης, DMA @ 25.0 °C | 11500.0 N/mm² (1667934.0 psi ) |
| Σημείο υαλώδους μετάπτωσης | 118.0 °C |
LOCTITE® ECCOBOND UF 8830S
This liquid epoxy underfill encapsulant is specially formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.