LOCTITE® ECCOBOND UF 8830S

Features and Benefits

This liquid epoxy underfill encapsulant is specially formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.
LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is specially designed to improve crack/fracture resistance and deliver faster flow. When fully cured, it forms a rigid, low-stress seal that dissipates stress in solder joints and extends thermal cycling performance.
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Technical Information

Coefficient of thermal expansion (CTE), Above Tg 100.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 25.0 ppm/°C
Glass transition temperature (Tg) 118.0 °C
Storage modulus, DMA @ 25.0 °C 11500.0 N/mm² (1667934.0 psi )
Storage temperature -40.0 °C
Viscosity, Brookfield, @ 25.0 °C Spindle 51, Speed 5 rpm 22120.0 mPa·s (cP)