LOCTITE® ECCOBOND UF 8830S
Features and Benefits
This epoxy-based, gray, high-purity underfill encapsulant is designed for tight bump pitches and narrow gaps in flip-chip BGA applications.
LOCTITE® ECCOBOND UF 8830S is a gray, high-purity underfill encapsulant. It’s typically used for tight bump pitches and narrow gaps in flip-chip BGA applications, improving crack/fracture resistance and delivering faster flow. It exhibits a long staging time and work life and is proven stable at 260°C (500°F) reflow for Pb-free, low-k applications. LOCTITE® ECCOBOND UF 8830S is formulated with an epoxy-based resin and cures when exposed to heat. When fully cured, it forms a rigid, low-stress seal that dissipates stress in solder joints and extends thermal cycling performance.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 100.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 25.0 ppm/°C |
| Glass transition temperature (Tg) | 118.0 °C |
| Storage modulus, DMA @ 25.0 °C | 11500.0 N/mm² (1667934.0 psi ) |
| Storage temperature | -40.0 °C |
| Viscosity, Brookfield, @ 25.0 °C Spindle 51, Speed 5 rpm | 22120.0 mPa·s (cP) |
LOCTITE® ECCOBOND UF 8830S
This epoxy-based, gray, high-purity underfill encapsulant is designed for tight bump pitches and narrow gaps in flip-chip BGA applications.