LOCTITE® ECCOBOND UF 8830S
Merkmale und Vorteile
This liquid epoxy underfill encapsulant is specially formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.
LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is specially designed to improve crack/fracture resistance and deliver faster flow. When fully cured, it forms a rigid, low-stress seal that dissipates stress in solder joints and extends thermal cycling performance.
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Technische Informationen
| Glasübergangstemperatur (Tg) | 118.0 °C |
| Lagertemperatur | -40.0 °C |
| Speichermodul, DMA @ 25.0 °C | 11500.0 N/mm² (1667934.0 psi ) |
| Viskosität, Brookfield, @ 25.0 °C Spindle 51, Speed 5 rpm | 22120.0 mPa.s (cP) |
| Wärmeausdehnungskoeffizient (CTE), Above Tg | 100.0 ppm/°C |
| Wärmeausdehnungskoeffizient (CTE), Below Tg | 25.0 ppm/°C |
LOCTITE® ECCOBOND UF 8830S
This liquid epoxy underfill encapsulant is specially formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.