LOCTITE® ECCOBOND UF 3800

Merkmale und Vorteile

LOCTITE ECCOBOND UF 3800, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
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Technische Informationen

Aushärtezyklus, @ 130.0 °C 8.0 Min.
Glasübergangstemperatur (Tg) 69.0 °C
Viskosität, Physica MCR100 @ 25.0 °C Spindle CP50-1 375.0 mPa.s (cP)
Wärmeausdehnungskoeffizient (CTE), Above Tg 188.0 ppm/°C
Wärmeausdehnungskoeffizient (CTE), Below Tg 52.0 ppm/°C