LOCTITE® ECCOBOND UF 3800
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LOCTITE ECCOBOND UF 3800, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
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Techniniai duomenys
| Kietėjimo planas, @ 130.0 °C | 8.0 min. |
| Klampumas, Physica MCR100 @ 25.0 °C Spindle CP50-1 | 375.0 mPa.s (cP) |
| Stiklėjimo temperatūra (Tg) | 69.0 °C |
| Šiluminio plėtimosi koeficientas (CTE), Above Tg | 188.0 ppm/°C |
| Šiluminio plėtimosi koeficientas (CTE), Below Tg | 52.0 ppm/°C |
LOCTITE® ECCOBOND UF 3800
LOCTITE ECCOBOND UF 3800, Epoxy, Underfill