LOCTITE® ECCOBOND UF 3800
Features and Benefits
LOCTITE ECCOBOND UF 3800, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 188.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 52.0 ppm/°C |
| Cure schedule, @ 130.0 °C | 8.0 min. |
| Glass transition temperature (Tg) | 69.0 °C |
| Viscosity, Physica MCR100 @ 25.0 °C Spindle CP50-1 | 375.0 mPa·s (cP) |
LOCTITE® ECCOBOND UF 3800
LOCTITE ECCOBOND UF 3800, Epoxy, Underfill