LOCTITE® ECCOBOND UF 3800

Características y Ventajas

LOCTITE ECCOBOND UF 3800, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
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Información técnica

Coeficiente de dilatación térmica (CDT), Above Tg 188.0 ppm/°C
Coeficiente de dilatación térmica (CDT), Below Tg 52.0 ppm/°C
Programa de curado, @ 130.0 °C 8.0 min
Temperatura de transición vítrea (Tg) 69.0 °C
Viscosidad, Physica MCR100 @ 25.0 °C Spindle CP50-1 375.0 mPa.s (cP)