LOCTITE® ECCOBOND UF 3800

Caractéristiques et avantages

LOCTITE ECCOBOND UF 3800, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
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Informations techniques

Coefficient de dilatation thermique (CDT), Above Tg 188.0 ppm/°C
Coefficient de dilatation thermique (CDT), Below Tg 52.0 ppm/°C
Programme de durcissement, @ 130.0 °C 8.0 min
Température de transition vitreuse 69.0 °C
Viscosité, Physica MCR100 @ 25.0 °C Spindle CP50-1 375.0 mPa.s (cP)