LOCTITE® ECCOBOND FP4526
功能與優點
This low viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip chip applications.
LOCTITE® ECCOBOND FP4526 is a heat-curable 63% filled underfill designed for capillary flow on flip chip applications. Its fast flow and low viscosity, along with its excellent wettability and adhesion, make it ideal for high reliability applications. It can be used on ceramic, organic, solder mask and polyimide substrates, but is perfect for ceramic packages and FC on flex applications.
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技術資訊
| 建議固化方式, @ 165.0 °C | 15.0 分 |
| 彎曲模量 | 8500.0 N/mm² (1232500.0 psi ) |
| 熱膨脹係數 (CTE), Above Tg | 101.0 ppm/°C |
| 熱膨脹係數 (CTE), Below Tg | 33.0 ppm/°C |
| 玻璃化溫度(Tg) | 133.0 °C |
| 粘度，Brookfield 錐型和板型, @ 25.0 °C Spindle 52, speed 10 rpm | 4700.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4526
This low viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip chip applications.