LOCTITE® ECCOBOND FP4526
Features and Benefits
This low viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip chip applications.
LOCTITE® ECCOBOND FP4526 is a heat-curable 63% filled underfill designed for capillary flow on flip chip applications. Its fast flow and low viscosity, along with its excellent wettability and adhesion, make it ideal for high reliability applications. It can be used on ceramic, organic, solder mask and polyimide substrates, but is perfect for ceramic packages and FC on flex applications.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 101.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 33.0 ppm/°C |
| Cure schedule, @ 165.0 °C | 15.0 min. |
| Flexural modulus | 8500.0 N/mm² (1232500.0 psi ) |
| Glass transition temperature (Tg) | 133.0 °C |
| Viscosity, Brookfield Cone & Plate, @ 25.0 °C Spindle 52, speed 10 rpm | 4700.0 mPa·s (cP) |
LOCTITE® ECCOBOND FP4526
This low viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip chip applications.