LOCTITE® ECCOBOND FP4526
Características e Benefícios
This low viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip chip applications.
LOCTITE® ECCOBOND FP4526 is a heat-curable 63% filled underfill designed for capillary flow on flip chip applications. Its fast flow and low viscosity, along with its excellent wettability and adhesion, make it ideal for high reliability applications. It can be used on ceramic, organic, solder mask and polyimide substrates, but is perfect for ceramic packages and FC on flex applications.
Ler mais
Documentos e Downloads
Procurando por um TDS ou MSDS / FISPQ em outro idioma?
Informação Técnica
| Coeficiente de expansão térmica (CTE), Above Tg | 101.0 ppm/°C |
| Coeficiente de expansão térmica (CTE), Below Tg | 33.0 ppm/°C |
| Cronograma de cura, @ 165.0 °C | 15.0 min. |
| Módulo flexural | 8500.0 N/mm² (1232500.0 psi ) |
| Temperatura de transição do vidro (Tg) | 133.0 °C |
| Viscosidade, Brookfield Cone & Placa, @ 25.0 °C Spindle 52, speed 10 rpm | 4700.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4526
This low viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip chip applications.