LOCTITE® ECCOBOND FP4526
Características y Ventajas
This low viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip chip applications.
LOCTITE® ECCOBOND FP4526 is a heat-curable 63% filled underfill designed for capillary flow on flip chip applications. Its fast flow and low viscosity, along with its excellent wettability and adhesion, make it ideal for high reliability applications. It can be used on ceramic, organic, solder mask and polyimide substrates, but is perfect for ceramic packages and FC on flex applications.
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Información técnica
| Coeficiente de dilatación térmica (CDT), Above Tg | 101.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Below Tg | 33.0 ppm/°C |
| Módulo de Flexión | 8500.0 N/mm² (1232500.0 psi ) |
| Programa de curado, @ 165.0 °C | 15.0 min |
| Temperatura de transición vítrea (Tg) | 133.0 °C |
| Viscosidad, Brookfield Cono & Placa, @ 25.0 °C Spindle 52, speed 10 rpm | 4700.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4526
This low viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip chip applications.