LOCTITE® ECCOBOND FP4526
Caractéristiques et avantages
This low viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip chip applications.
LOCTITE® ECCOBOND FP4526 is a heat-curable 63% filled underfill designed for capillary flow on flip chip applications. Its fast flow and low viscosity, along with its excellent wettability and adhesion, make it ideal for high reliability applications. It can be used on ceramic, organic, solder mask and polyimide substrates, but is perfect for ceramic packages and FC on flex applications.
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Informations techniques
| Coefficient de dilatation thermique (CDT), Above Tg | 101.0 ppm/°C |
| Coefficient de dilatation thermique (CDT), Below Tg | 33.0 ppm/°C |
| Module de flexion | 8500.0 N/mm² (1232500.0 psi ) |
| Programme de durcissement, @ 165.0 °C | 15.0 min |
| Température de transition vitreuse | 133.0 °C |
| Viscosité, Brookfield Cône & Plan, @ 25.0 °C Spindle 52, speed 10 rpm | 4700.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4526
This low viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip chip applications.