LOCTITE® ECCOBOND FP4526

Vlastnosti a výhody

This low viscosity, fast-flow epoxy underfill is specially designed for capillary flow on flip chip applications.
LOCTITE® ECCOBOND FP4526 is a heat-curable 63% filled underfill designed for capillary flow on flip chip applications. Its fast flow and low viscosity, along with its excellent wettability and adhesion, make it ideal for high reliability applications. It can be used on ceramic, organic, solder mask and polyimide substrates, but is perfect for ceramic packages and FC on flex applications.
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Technické informace

Koeficient tepelné roztažnosti (CTE), Above Tg 101.0 ppm/°C
Koeficient tepelné roztažnosti (CTE), Below Tg 33.0 ppm/°C
Pevnost v ohybu 8500.0 N/mm² (1232500.0 psi )
Plán vytvrzení, @ 165.0 °C 15.0 min.
Teplota skelného přechodu (Tg) 133.0 °C
Viskozita, Brookfield Kužel & deska, @ 25.0 °C Spindle 52, speed 10 rpm 4700.0 mPa.s (cP)