LOCTITE® ABLESTIK ABP 8142B
功能与优点
This silicone, low modulus, non-conductive die attach adhesive is designed for MEMs package applications.
LOCTITE® ABLESTIK ABP 8142B3 is a non-conductive die attach adhesive specially designed for MEMs package applications. It is low modulus and has black pigmentation for blocking light.
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技术信息
| 固化方式 | 快速固化 |
| 应用 | 芯片焊接 |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 12254.0 mPa.s (cP) |
| 触变指数 | 3.3 |
LOCTITE® ABLESTIK ABP 8142B
This silicone, low modulus, non-conductive die attach adhesive is designed for MEMs package applications.