LOCTITE® ABLESTIK ABP 8142B
Features and Benefits
This silicone, low modulus, non-conductive die attach adhesive is designed for MEMs package applications.
LOCTITE® ABLESTIK ABP 8142B3 is a non-conductive die attach adhesive specially designed for MEMs package applications. It is low modulus and has black pigmentation for blocking light.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Applications | Die attach |
| Cure type | Snap cure |
| Thixotropic index | 3.3 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 12254.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 8142B
This silicone, low modulus, non-conductive die attach adhesive is designed for MEMs package applications.