LOCTITE® ABLESTIK ABP 8142B
Características y Ventajas
This silicone, low modulus, non-conductive die attach adhesive is designed for MEMs package applications.
LOCTITE® ABLESTIK ABP 8142B3 is a non-conductive die attach adhesive specially designed for MEMs package applications. It is low modulus and has black pigmentation for blocking light.
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Información técnica
| Aplicaciones | Unión |
| Tipo de curado | Curado Instantáneo |
| Viscosidad, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 12254.0 mPa.s (cP) |
| Índice tixotrópico | 3.3 |
LOCTITE® ABLESTIK ABP 8142B
This silicone, low modulus, non-conductive die attach adhesive is designed for MEMs package applications.