LOCTITE® ABLESTIK ABP 8142B

Features and Benefits

This silicone, low modulus, non-conductive die attach adhesive is designed for MEMs package applications.
LOCTITE® ABLESTIK ABP 8142B3 is a non-conductive die attach adhesive specially designed for MEMs package applications. It is low modulus and has black pigmentation for blocking light.
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Technical Information

Applications Die attach
Cure type Snap cure
Thixotropic index 3.3
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 12254.0 mPa·s (cP)