LOCTITE® ABLESTIK ABP 8142B
特長および利点
This silicone, low modulus, non-conductive die attach adhesive is designed for MEMs package applications.
LOCTITE® ABLESTIK ABP 8142B3 is a non-conductive die attach adhesive specially designed for MEMs package applications. It is low modulus and has black pigmentation for blocking light.
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技術情報
| アプリケーション(用途) | ダイ接着剤 |
| チクソ性指数 | 3.3 |
| 硬化タイプ | スナップキュアー |
| 粘度、ブルックフィールド CP51, @ 25.0 °C Speed 5 rpm | 12254.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8142B
This silicone, low modulus, non-conductive die attach adhesive is designed for MEMs package applications.