LOCTITE® ABLESTIK ABP 6892
특징 및 이점
LOCTITE ABLESTIK ABP 6892, Die Attach
LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination and overall improvement in package reliability.
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기술 정보
| 경화 방식 | 열경화 |
| 열팽창 계수(CTE) | 111.4 ppm/°C |
| 열팽창 계수(CTE), Above Tg | 190.6 ppm/°C |
| 요변성 지수 | 1.75 |
| 유리전이온도(Tg) | -25.0 °C |
| 적용 분야 | 다이 접착 |
| 점도, Brookfield, @ 25.0 °C Speed 0.5 rpm | 4100.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 6892
LOCTITE ABLESTIK ABP 6892, Die Attach